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ISL9016IRUGCZ-T Datasheet(PDF) 11 Page - Intersil Corporation |
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ISL9016IRUGCZ-T Datasheet(HTML) 11 Page - Intersil Corporation |
11 / 11 page 11 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6832.0 January 22, 2009 Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN) B D A E 0.15 C 2X PIN 1 TOP VIEW 0.15 C 2X REFERENCE DETAIL A 0.10 C 0.08 C 6X A3 C SEATING PLANE L e 46 31 BOTTOM VIEW SIDE VIEW 0.10 CAB b6X DETAIL A 0.127 +0.058 A1 A1 A 0.127±0.008 64 13 M CO.2 1.00 REF D2 DAP SIZE 1.30 x 0.76 E2 -0.008 TERMINAL THICKNESS 0.30 1.00 0.45 0.50 0.25 1.25 2.00 1.00 LAND PATTERN 6 L6.1.6x1.6A 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE SYMBOL MILLIMETERS NOTES MIN NOMINAL MAX A 0.45 0.50 0.55 - A1 - - 0.05 - A3 0.127 REF - b 0.15 0.20 0.25 - D 1.55 1.60 1.65 4 D2 0.40 0.45 0.50 - E 1.55 1.60 1.65 4 E2 0.95 1.00 1.05 - e 0.50 BSC - L 0.25 0.30 0.35 - Rev. 1 6/06 NOTES: 1. Dimensions are in mm. Angles in degrees. 2. Coplanarity applies to the exposed pad as well as the terminals. Coplanarity shall not exceed 0.08mm. 3. Warpage shall not exceed 0.10mm. 4. Package length/package width are considered as special characteristics. 5. JEDEC Reference MO-229. 6. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. ISL9016 |
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