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FAN7083_F085 Rev. 1.0.2

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are

absolute voltages referenced to COM.

Note: 1) The thermal resistance and power dissipation rating are measured bellow conditions;

JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions - Natural convection(StillAir)

JESD51-3 : Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Package

Recommended Operating Conditions

Note : 1) Guaranteed by design.

2) Duty = 0.5

Parameter

Symbol

Min.

Max.

Unit

High side floating supply offset voltage

V

High side floating supply voltage

-0.3

625

V

High side floating output voltage

Vs-0.3

V

Supply voltage

-0.3

25

V

Input voltage for IN

VIN

-0.3

V

V

Input voltage for RESET

-0.3

V

V

Power Dissipation

1)

Pd

0.625

W

Thermal resistance, junction to ambient

1)

Rthja

200

°C/W

Electrostatic discharge voltage

(Human Body Model)

1K

V

Charge device model

V

CDM

500

V

Junction Temperature

Tj

150

°C

Storage Temperature

-55

150

°C

Parameter

Symbol

Min.

Max.

Unit

High side floating supply voltage

-10V Transient 0.2us

V

V

V

High side floating supply offset voltage(DC)

-5

600

V

-25 (~200ns)

-20(200ns~240ns)

-7(240ns~400ns)

600

V

High side floating output voltage

V

s

V

Allowable offset voltage Slew Rate

1)

dv/dt

-

50

V/ns

Supply voltage

10

20

V

Input voltage for IN

0

Vcc

V

Input voltage for RESET

0

Vcc

V

Switching Frequency

2)

Fs

200

KHz

Ambient Temperature

-40

125

°C