Specifications given herein may be changed at any time without pr ior notice. Please confir m technical specifications before you order and/or use.

PAGE 7 OF 7

SS-210 R5

10. Recommended Washing Condition

Isopropyl alcohol and methyl alcohol used for the washing process will not affect the part performance.

Ultrasonic cleaning should be changed to condition for size of printed wiring board and

type of oscillator. Overpowering of ultrasonic cleaning will cause problems according to resonant

phenomenon. Condition of ultrasonic cleaner should be confirmed prior to use.

We recommend the following conditions:

Ultrasonic power: Within 20W/1

Cleaning times:

Within 5 minutes

11. Storage

Chip inductors should not be stored under high temperature and high humidity conditions.

In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise,

the packing material may be deformed, causing problems during mounting.

(2) Reel dimensions

.079

(2

± 0.5)

Marking

place

.511

(13

± 0.5)

.448 (11.4

± 1.5)

2.36

(60

± 2.0)

7.00

(178

± 2.0)

.393 (10

± 1.5)

(Marking item)

(1) Type designation

(2) Nominal inductance

(3) Quantity

(4) Production lot number

(5) Manufacturer's name

Dimensions in inches (mm)

9. Recommended Soldering Condition

9-1 Dimensions of Standard Land

Size

A

B

C

2A

.047 ~ .055

.035 ~ .051

.016 ~ .031

(1.2 ~ 1.4)

(0.9 ~ 1.3)

(0.4 ~ 0.8)

Dimensions in inches (mm)

A

C

B

Chip coil

Land

Solder resist

9-2 Soldering Condition

Reflow soldering should be done at 240°C

within 20 seconds. Flow soldering should be

done at 260°C within 10 seconds. Please

use suitable solder quantity, too much

solder may affect performance of product.

Solder

Solder

KOA SPEER ELECTRONICS, INC.