KGM

three-terminal capacitor

environmental applications (continued)

Performance Characteristics

Parameter

Requirement

Test Method

Temperature Cycle*

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

Solderability

More than 95% of the terminal electrode

shall be covered with new solder

Flux: 25% rosin Preheating: 60 seconds

Preheating Temperature: 150°C

Solder: H60A

Solder Temperature: 230°C ±5°C

Dip Time: 4 seconds ± 1 second

Repeat the following heat cycle 10 times:

Step:

Temperature:

Time:

1

-40°C ± 3°C

30 minutes ± 3 minutes

2

Room Temp.

15 minutes maximum

3

85°C ± 2°C

30 minutes ± 3 minutes

4

Room Temp.

15 minutes maximum

High Temperature

Resistance*

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

Temperature: 70°C ± 2°C

Bias: 150% of rated voltage

Test Time: 1000 +48/-0 hours

Humidity Resistance

(Unload)*

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

Temperature: 85°C ± 2°C

Humidity: 85% ± 5%

Test Time: 500 +24/-0 hours

Humidity Resistance

(Load)*

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

Temperature: 40°C ± 2°C

Humidity: 90 - 95%

Bias: 100% of rated voltage

Test Time: 500 +24/-0 hours

Vibration

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

The frequency of applied vibration should be swept

from 10 Hz to 55 Hz and return to 10 Hz. This cycle

time should be about 1 minute and this cycle should

be repeated.

Amplitude (Total Excursion): 1.5 mm

This motion shall be applied for a period of 2 hours in

each of 3 mutually perpendicular axes (total of 6 hours).

Low Temperature

Resistance

(Unload)*

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

Temperature: -40°C ± 2°C

Test Time: 1000 +48/-0 hours

Weight

20

Displacement

Substrate

45

± 2

45

± 2

Substrate Bending Test

Appearance: No physical damage

Capacitance: Within tolerance

After soldering a chip to a test

substrate, bend the substrate

by 1 mm and then measure.

The substrate is GE4 or

based on GE4.

* After temperature cycle test, high temperature resistance test, humidity resistance test or low temperature resistance test, the tested sample

should be measured after having been left in temperature from 15°C to 35°C and relative humidity from 45% to 75% for 24 hours.

Resistance to Solder Heat

Appearance: No physical damage

Capacitance: Within tolerance

Dielectric Loss: Within tolerance

Insulation Resistance: Within tolerance

Flux: 25% rosin Preheating: 60 seconds

Preheating Temperature: 150°C

Solder: H60A

Solder Temperature: 260°C ±5°C

Dip Time: 5 seconds ± 0.5 second

Terminal Adhesion Strength

No physical damage

Solder a chip to a test

substrate and then

laterally apply a

load (5N, 500gF) in

the arrow direction

Substrate

Chip

275

KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

3/05/07