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EDBS03TTE5V0 Datasheet(PDF) 1 Page - KOA Speer Electronics, Inc.

Part # EDBS03TTE5V0
Description  bidirectional esd suppressor
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Manufacturer  KOA [KOA Speer Electronics, Inc.]
Direct Link  http://www.koaspeer.com
Logo KOA - KOA Speer Electronics, Inc.

EDBS03TTE5V0 Datasheet(HTML) 1 Page - KOA Speer Electronics, Inc.

  EDBS03TTE5V0 Datasheet HTML 1Page - KOA Speer Electronics, Inc. EDBS03TTE5V0 Datasheet HTML 2Page - KOA Speer Electronics, Inc.  
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196
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
2/24/08
EDA
EDB
EDC
EDD
PMS 300 neg.
Black neg.
ED(X)
bidirectional esd suppressor
features
(16kV) IEC 61000-4-2 rating
Surface mount package
High component density
Products with lead-free terminations meet EU RoHS
and China RoHS requirements
ordering information
From table above
TE: 7" embossed
plastic tape
EDA
S03
TE
16V
Packaging
Type
Package
Code
Voltage
New Part #
For further information on packaging, please refer to Appendix A.
dimensions and construction
L
Die
Pad
Molded
Resin
Bonding
Wire
Si
Wafer
P
Lead
d
W
5V0
16V
applications
ESD suppression
Transient suppression
circuit schematic
1
2
3
Package
Code
W ±0.2
L ±0.2
Pins
Dimensions inches
(mm)
3
.114
(2.90)
.091
(2.30)
S03
6
.114
(2.90)
.110
(2.80)
S06
Total
Power
225mw
225mw
p ±0.1
––
.037
(0.95)
Pkg Ht
±0.2
.039
(1.0)
.039
(1.0)
d ±0.05
.017
(0.43)
.017
(0.43)
W
L
Lead
Die
Pad
Molded
Resin
Bonding
Wire
Si
Wafer
p
d
S03
S06
EDA
2
3
1
4
5
6
EDB
2
3
1
4
5
6
EDC
T: Sn
T
Lead
Plating
5
.114
(2.90)
.110
(2.80)
S05
225mw
.037
(0.95)
.039
(1.0)
.017
(0.43)
2
3
1
4
5
EDD
W
L
Lead
Die
Pad
Molded
Resin
Bonding
Wire
Si
Wafer
p
d
P
S05
P ±0.1
.075
(1.90)
––
.075
(1.90)
EU
1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328
1/27/09
4:44 PM
Page 1


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