KOA SPEER ELECTRONICS, INC.

SS-224 R5

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

PAGE 8 OF 8

10. Recommended PC Board Land Patterns - inches (mm)

Chip Component Size

Size

LW

AB

C

E

1206

.126

.063

.030

.120

.016

.031

(3216)

(3.2)

(1.6)

(0.762) (3.048) (0.406) (0.787)

Soldering

Pad

Chip

Component

L

C

E

BW

A

Item

Requirement

Conditions

Thermal Shock

Appearance: There shall be no physical or

Step

Temperature

Time

mechanical damage.

1-start

-40°C ±2°C

—

Impedance: Relative to initial value ±20%.

2-hold

-40°C ±2°C

30 min ±5 min

DCR: The DCR shall not exceed initial specified

3-transfer

—

0.5 min max.

value.

4-hold

+105°C ±2°C 30 min ±5 min

5-transfer

—

0.5 min max.

Testing of the parts will be made at 0 hours, 250

hours and 500 hours. Before testing the parts

Steps 1 thru 5 constitute one complete cycle

shall be allowed to cool to room temperature for

and the test shall consist of a total of 500

24 hours.

cycles.

Load Humidity

Appearance: There shall be no physical or

Temperature: 85°C ±2°C

mechanical damage

Relative Humidity: 85%

Impedance: Relative to initial value ±15%

Time: 1,000 hours total

Apply: 100% rated current

Measurements shall be taken at 0 hours, 250

hours, 500 hours and 1,000 hours and shall meet

the conditions stated above.

Life Test

Appearance: There shall be no physical or

Temperature: 85°C ±2°C

mechanical damage

Time: 1,000 hours total

Impedance: Relative to initial value ±15%

Apply: 100% rated current

Measurements shall be taken at 0 hours, 250

hours, 500 hours and 1,000 hours and shall meet

the conditions stated above.

9. Characteristics (continued)