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LTC3459EDC-PBF Datasheet(PDF) 11 Page - Linear Technology |
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LTC3459EDC-PBF Datasheet(HTML) 11 Page - Linear Technology |
11 / 12 page LTC3459 11 3459fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. PACKAGE DESCRIPTION DCB Package 6-Lead Plastic DFN (2mm × 3mm) (Reference LTC DWG # 05-08-1715) S6 Package 6-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1636) 3.00 ±0.10 (2 SIDES) 2.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ± 0.10 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP R = 0.05 TYP 1.35 ±0.10 (2 SIDES) 1 3 6 4 PIN 1 BAR TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DCB6) DFN 0405 0.25 ± 0.05 0.50 BSC PIN 1 NOTCH R0.20 OR 0.25 × 45° CHAMFER 0.25 ± 0.05 1.35 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.65 ±0.05 (2 SIDES) 2.15 ±0.05 0.70 ±0.05 3.55 ±0.05 PACKAGE OUTLINE 0.50 BSC 1.50 – 1.75 (NOTE 4) 2.80 BSC 0.30 – 0.45 6 PLCS (NOTE 3) DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S6 TSOT-23 0302 REV B 2.90 BSC (NOTE 4) 0.95 BSC 1.90 BSC 0.80 – 0.90 1.00 MAX 0.01 – 0.10 0.20 BSC 0.30 – 0.50 REF PIN ONE ID NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3.85 MAX 0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN 2.62 REF 1.22 REF |
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