LTC2934

10

2934f

2.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

0.64

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

1.37

±0.10

(2 SIDES)

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DC8) DFN 0106 REVØ

0.23

± 0.05

0.45 BSC

0.25

± 0.05

1.37

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.64

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.45 BSC

PIN 1 NOTCH

R = 0.20 OR

0.25

× 45°

CHAMFER

PACKAGE DESCRIPTION

DC Package

8-Lead Plastic DFN (2mm

× 2mm)

(Reference LTC DWG # 05-08-1719 Rev Ø)