10/2008

AWT6321

3.4 V Linear Power Amplifier Module

Data Sheet - Rev 2.2

M28 Package

14 Pin 3 mm x 5 mm x 1 mm

Surface Mount Module

FEATURES

• InGaP HBT Technology

• High Efficiency:

19 % @ +16 dBm

39 % @ +28 dBm

• Low Quiescent Current: 15 mA

• Internal Voltage Regulation

• Reduced External Component Count

• Low Profile Surface Mount Package: 1 mm

• Suitable for BC10 (806-824 MHz) band

applications

APPLICATIONS

• CDMA/EVDO & Cell & PCS Dual-band Wireless

Handsets and Data Devices

PRODUCT DESCRIPTION

The AWT6321 addresses the demand for increased

integration in dual-band handsets for North American

CDMA network deployments. The small footprint 3

mm x 5 mm x 1 mm surface mount RoHS compliant

package contains independent RF PA paths to ensure

optimal performance in both frequency bands, while

achieving a 25% PCB space savings compared with

solutions requiring two single-band PAs. The package

pinout was chosen to enable handset manufacturers

device is manufactured on an advanced InGaP HBT

MMIC technology offering state-of-the-art reliability,

temperature stability, and ruggedness. The AWT6321

is part of ANADIGICS’ High-Efficiency-at-Low-Power

(HELP™) family of CDMA power amplifiers, which

deliver low quiescent currents and significantly

greater efficiency without a costly external DAC or

DC-DC converter. Through selectable bias modes, the

AWT6321 achieves optimal efficiency across different

output power levels, specifically at low- and mid-

range power levels where the PA typically operates,

thereby dramatically increasing handset talk-time and

standby-time. Its built-in voltage regulator eliminates

the need for external switches. The 3 mm x 5 mm x

1 mm surface mount package incorporates matching

networks optimized for output power, efficiency and

linearity in a 50 Ω system.

Figure 1: Block Diagram