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LTM8040EV-PBF Datasheet(PDF) 6 Page - Linear Technology |
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LTM8040EV-PBF Datasheet(HTML) 6 Page - Linear Technology |
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6 / 16 page  LTM8040 6 8040p BLOCK DIAGRAM VIN SHDN PWM GND RT ADJ 80.6k 5.11k INTERNAL 1.25V 0.1μF 4.7μF 8.2μH SENSE RESISTOR LPWR LEDA BIAS INTERNAL COMPENSATION CURRENT MODE CONTROLLER 8040 BD PIN FUNCTIONS pin floating. Please refer to the Applications Information section for details. PWM (Pin L7): Input Pin for PWM Dimming Control. A PWM signal above 0.9V (ON threshold) turns the on output current source, while a PWM signal below 0.5V shuts it down. If the application does not require PWM dimming, then the PWM pin can be left either open (an internal 10μA source current pulls PWM high) or pulled up to a voltage source between 1.2V and 10V. VIN(Bank3):TheVINpinsuppliescur-renttotheLTM8040’s internal power converter and other circuitry. It must be lo- cally bypassed with a high quality (low ESR) capacitor. ADJ (Pin L3): Use the ADJ pin to scale the LEDA output current below 1A by either applying a voltage source or by connecting a resistor to GND. This pin is internally pulled up to a 1.25V reference through a 5.11K resistor, so ensure that the voltage source can drive a 5.11K impedance. If applying a voltage to ADJ, the LEDA current follows the formula: ILED = 1A • ADJ/1.25V. If connecting a resistor to GND, the resistor value should be R = 5.11 • ILED /(1Amp – ILED), where R is in KΩ and ILED is the desired current out of LEDA in Amps. Make sure that the voltage at LEDA is at least 2.4V. RT (Pin L2): The RT pin is used to set the internal oscillator frequency. An 80.6k resistor has already been installed inside the LTM8040 to default switching frequency to 500kHz. If no modification of the switching frequency is necessary, leave this pin floating. Otherwise, a parallel resistor applied from RT to GND will raise the switching frequency. See table 2 for details. GND (Bank 2): Tie all GND pins directly to a local ground plane. These pins serve as both signal and power return to the LTM8040 μModule, as well as providing the primary thermal path for heat dissipation within the unit. See the Applications Information section for more information about heat-sinking and printed circuit board layout. |
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