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RT54SX72S-1CQ256B Datasheet(PDF) 7 Page - Actel Corporation

Part # RT54SX72S-1CQ256B
Description  RTSX-S RadTolerant FPGAs
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Manufacturer  ACTEL [Actel Corporation]
Direct Link  http://www.actel.com
Logo ACTEL - Actel Corporation

RT54SX72S-1CQ256B Datasheet(HTML) 7 Page - Actel Corporation

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RTSX-S RadTolerant FPGAs
v2.2
1-1
General Description
RTSX-S RadTolerant FPGAs are enhanced versions of
Actel’s SX-A family of devices, specifically designed for
enhanced radiation performance.
Featuring SEU-hardened D-type flip-flops that offer the
benefits of Triple Module Redundancy (TMR) without the
associated overhead, the RTSX-S family is a unique
product offering for space applications. Manufactured
using 0.25 µm technology at the Matsushita (MEC)
facility in Japan, RTSX-S offers levels of radiation
survivability far in excess of typical CMOS devices.
Device Architecture
Actel's RTSX-S architecture, derived from the highly
successful SX-A sea-of-modules architecture, has been
designed to improve upset and total-dose performance
in radiation environments.
With three layers of metal interconnect in the RT54SX32S
and four metal layers in RT54SX72S, the RTSX-S family
provides efficient use of silicon by locating the routing
interconnect resources between the top two metal
layers. This completely eliminates the channels of routing
and interconnect resources between logic modules as
found
in
traditional
FPGAs.
In
a
sea-of-modules
architecture, the entire floor of the FPGA is covered with
a grid of logic modules with virtually no chip area lost to
interconnect elements or routing.
The RTSX-S architecture adds several enhancements over
the SX-A architecture to improve its performance in
radiation environments, such as SEU-hardened flip-flops,
wider clock lines, and stronger clock drivers.
Programmable Interconnect
Element
Interconnection between logic modules is achieved using
Actel’s patented metal-to-metal programmable antifuse
interconnect elements. The antifuses are normally open
circuit
and
form
a
permanent,
low-impedance
connection when programmed.
The metal-to-metal antifuse is made up of a combination
of amorphous silicon and dielectric material with barrier
metals and has a programmed (“on” state) resistance of
25
Ω with capacitance of 1.0 fF for low signal impedance
(Figure 1-1).
Figure 1-1 • RTSX-S Family Interconnect Elements
Silicon Substrate
Metal 4
Metal 3
Metal 2
Metal 1
Amorphous Silicon/
Dielectric Antifuse
Tungsten Plug Via
Tungsten Plug Via
Tungsten Plug Contact
Routing Tracks


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