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LT6600CS8-15-PBF Datasheet(PDF) 11 Page - Linear Technology |
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LT6600CS8-15-PBF Datasheet(HTML) 11 Page - Linear Technology |
11 / 12 page LT6600-15 11 660015fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) APPLICATIONS INFORMATION Table 2. LT6600-15 SO-8 Package Thermal Resistance COPPER AREA TOPSIDE (mm2) BACKSIDE (mm2) BOARD AREA (mm2) THERMAL RESISTANCE (JUNCTION-TO-AMBIENT) 1100 1100 2500 65°C/W 330 330 2500 85°C/W 35 35 2500 95°C/W 35 0 2500 100°C/W 0 0 2500 105°C/W Junction temperature, TJ, is calculated from the ambient temperature, TA, and power dissipation, PD. The power dissipation is the product of supply voltage, VS, and supply current, IS. Therefore, the junction temperature is given by: TJ = TA + (PD • θJA) = TA + (VS • IS • θJA) where the supply current, IS, is a function of signal level, load impedance, temperature and common mode voltages. For a given supply voltage, the worst-case power dis- sipation occurs when the differential input signal is maximum, the common mode currents are maximum (see Applications Information regarding common mode DC currents), the load impedance is small and the ambi- ent temperature is maximum. To compute the junction temperature, measure the supply current under these worst-case conditions, estimate the thermal resistance from Table 2, then apply the equation for TJ. For example, using the circuit in Figure 3 with a DC differential input voltage of 250mV, a differential output voltage of 1V, no load resistance and an ambient temperature of 85°C, the supply current (current into Pin 3) measures 50mA. As- suming a PC board layout with a 35mm2 copper trace, the θJA is 100°C/W. The resulting junction temperature is: TJ = TA + (PD • θJA) = 85 + (5 • 0.05 • 100) = 110°C When using higher supply voltages or when driving small impedances, more copper may be necessary to keep TJ below 150°C. PACKAGE DESCRIPTION .016 – .050 (0.406 – 1.270) .010 – .020 (0.254 – 0.508) × 45° 0°– 8° TYP .008 – .010 (0.203 – 0.254) SO8 0303 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC 1 2 3 4 .150 – .157 (3.810 – 3.988) NOTE 3 8 7 6 5 .189 – .197 (4.801 – 5.004) NOTE 3 .228 – .244 (5.791 – 6.197) .245 MIN .160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) |
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