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3724IFE Datasheet(PDF) 7 Page - Linear Technology |
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3724IFE Datasheet(HTML) 7 Page - Linear Technology |
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7 / 24 page  LT3724 7 3724fc PIN FUNCTIONS VCC (Pin 12): The VCC pin is the internal bias supply decou- pling node. Use low ESR 1μF ceramic capacitor to decouple this node to PGND. Most internal IC functions are powered from this bias supply. An external diode connected from VCC to the BOOST pin charges the bootstrapped capacitor during the off-time of the main power switch. Back driving the VCC pin from an external DC voltage source, such as the VOUT output of the buck regulator supply, increases overall efficiency and reduces power dissipation in the IC. In shutdown mode this pin sinks 20μA until the pin voltage is discharged to 0V. NC (Pin 13): No Connection. SW (Pin 14): In step-down applications the SW pin is connected to the cathode of an external clamping Schottky diode, the drain of the power MOSFET and the inductor. The SW node voltage swing is from VIN during the on- time of the power MOSFET, to a Schottky voltage drop below ground during the off-time of the power MOSFET. In start-up and in operating modes where there is insuf- ficient inductor current to freewheel the Schottky diode, an internal switch is turned on to pull the SW pin to ground so that the BOOST pin capacitor can be charged. Give careful consideration in choosing the Schottky diode to limit the negative voltage swing on the SW pin. TG (Pin 15): The TG pin is the bootstrapped gate drive for the top N-Channel MOSFET. Since very fast high cur- rents are driven from this pin, connect it to the gate of the power MOSFET with a short and wide, typically 0.02” width, PCB trace to minimize inductance. BOOST (Pin 16): The BOOST pin is the supply for the bootstrapped gate drive and is externally connected to a low ESR ceramic boost capacitor referenced to SW pin. The recommended value of the BOOST capacitor,CBOOST, is 50 times greater that the total input capacitance of the topside MOSFET. In most applications 0.1μF is adequate. The maximum voltage that this pin sees is VIN + VCC, ground referred. Exposed Pad (SGND) (Pin 17): The exposed leadframe is internally connected to the SGND pin. Solder the exposed pad to the PCB ground for electrical contact and optimal thermal performance. |
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