Socket Mounting Recommendations and Reflow Profile

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

E-tec Socket Mounting Recommendations

PRELIMINARY

2

Stencil

Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated

stainless steel stencil is recommended to give the most consistent paste release. The apertures

can be made round except for smaller pitches, where square apertures are recommended.

Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet

have provisions to remove it from the PCB once the paste has been applied.

Table 1: Recommended stencil dimensions.

Device Pitch

(mm)

PCB Pad Diameter

(mm / in)

Stencil Thickness

(mm/in)

Stencil Aperture

(mm/in)

1.27

min. 0.60 / 0.023

0.15 / 0.006

round 0.66 / 0.026

1.00

min. 0.50 / 0.019

0.15 / 0.006

round 0.55 / 0.022

0.80

min. 0.40 / 0.016

0.13 / 0.005

round 0.44 / 0.017

0.75

min. 0.35 / 0.014

0.13 / 0.005

square 0.39 / 0.015

0.65

min. 0.35 / 0.014

0.13 / 0.005

square 0.39 / 0.015

0.50

min. 0.30 / 0.012

0.13 / 0.005

square 0.33 / 0.013

Solder Paste

E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s

wetting ability and prevent the paste from running up the pins, thus maximizing the volume of

Reflow Profile

Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.