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LT3003EMSE Datasheet(PDF) 5 Page - Linear Technology |
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LT3003EMSE Datasheet(HTML) 5 Page - Linear Technology |
5 / 16 page LT3003 5 3003fa BLOCK DIAGRAM Figure 1. Block Diagram 1 2 – + – + – + 4 VEE B1 B2 B3 LED1 PWM 0.5V VMAX LED2 11 EXPOSED PAD LED3 3 VIN 3V 5 VEE SHDN 0.7V 9 OT1 7 PWM LOGIC THERMAL SHUTDOWN BIAS BG BG 125 °C 150 °C OT2 3003 F01 8 6 – + 10 – + B2 B1 VIN B3 VEE (Pin 10): Lower Rail. • Boost: Connect to System Ground • Buck Mode: Connect to Inductor • Buck-Boost Mode: Connect to Input Supply Exposed Pad (Pin 11): GND. The ground for the IC should be soldered to a continuous copper ground plane under the LT3003 die. Soldering the Exposed Pad to the copper ground plane under the device will reduce thermal resis- tance and increase the power capability of the LT3003. PIN FUNCTIONS |
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