Apr. 2008 Release / Orig

Page 2

Preliminary Data Sheet

NOTE:

(1) Thermal resistance from junction to ambient at 0.375” lead length, vertical P.C. board mounted

(2) Reverse Recovery Test Conditions: I

Package Outline

Package

Case Outline

DO-15

DO-15

Millimeters

Inches

DIM

Min

Max

Min

Max

A

0.70

0.90

0.028

0.034

B

5.80

7.60

0.230

0.300

C

25.40

---

1.000

---

D

2.60

3.60

0.104

0.140

A

D

B

C