Specifications subject to change without notice. All dimensions in inches. © Copyright 1998 The Connor-Winfield Corporation

2111 Comprehensive Drive

Aurora, Illinois 60505

Phone: 630- 851- 4722

Fax: 630- 851- 5040

www.conwin.com

Bulletin

Sm073

Page

2 of 2

Revision

01

Date

01 April 2002

Pin Connections

1: Enable/Disable

2: Ground

3: Output

4: Vcc

OSCILLOSCOPE

FREQ

COUNTER

OSC

POWER

SUPPLY

INPUT FOR E/D

PROBE

Meets EIA-481A and EIAJ-1009B

2,000 PCS/Reel

Bypass capacitor, C-by, should be

ceramic capacitor ≥ .01 uf

SYMMETRY

Soldering

General Conditions 260°C max x 10 sec max x 2 times max or

230°C max x 180 sec max x 1 time

Typical Operation Data

(Vapor phase reflow)

20 to 100 sec up to 215°C, 50 sec

at 215°C, then down to room temperature per 1 to 5°C / sec

Environmental Characteristics

Temperature Cycle

The specimen shall meet electrical characteristics after

tested 5 cycles of -55°C / 30 minutes and +125°C / 30 minutes

Hermetical

No bubbles appear in Flourinert (FC-43) at 125°C ±5°C for 5 minutes

Solvent Resistance

Marking will withstand immersion in

Isopropyl Alcohol or Trichloroethylene

Suggested Pad Layout

Ordering Information

5211

- 44.736 MHz

CLOCK

SERIES

CENTER

FREQUENCY

Mechanical Characteristics

Free Drop

The specimen shall meet electrical characteristics after tested 3 times,

Free Drop testing on the hard wooden board from a height of 75 cm.

Vibration

The specimen shall meet electrical characteristics after tested

by the following conditions: 10-55Hz 1.5mm Amplitude,

55-2000 Hz 20 G's, 2 hours for each plane

Thermal Shock

After applied Thermal Shock of 260°C

max x 10 sec max x 2 times, or 230°C max x 180 sec max,

the specimen shall meet electrical characteristics

Solderability

(EIAJ-RCX-0102.101 Condition 1a)

1) Flux: MIL-F-14256 (WW Rosin=25%, Isopropyl Alcohol = 75%)

2) Solder: QQ-S-571 (Sn = 63%, Pb = 37%)

3) Solder bath temperature: 235°C ±5°C

4) Depth of immersion: Up to electrical terminal

5) Immersing time: Within 2 sec ±0.5 sec into solder bath

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

After performing the above procedures, a newly soldered coverage shall be greater than 90%

Test Circuit

Output Waveform

Tape and Reel Dimensions

Package Characteristics

Package

Hermetically sealed ceramic package and metal cover

Dimensional Tolerance: ±.02" (.508mm)

±.005" (.127mm)