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LT1461ACS8-5 Datasheet(PDF) 10 Page - Linear Technology |
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LT1461ACS8-5 Datasheet(HTML) 10 Page - Linear Technology |
10 / 16 page 10 LT1461 Precision Regulator The LT1461 will deliver 50mA with VIN = VOUT + 2.5V and higher load current with higher VIN. Load regulation is typically 12ppm/mA, which means for a 50mA load step, the output will change by only 1.5mV. Thermal regulation, caused by die temperature gradients and created from load current or input voltage changes, is not measurable. This often overlooked parameter must be added to normal line and load regulation errors. The load regulation photo, on the first page of this data sheet, shows the output response to 200mW of instantaneous power dissipation and the reference shows no sign of thermal errors. The reference has thermal shutdown and will turn off if the junction temperature exceeds 150 °C. Shutdown The shutdown (Pin 3 low) serves to shut off load current when the LT1461 is used as a regulator. The LT1461 operates normally with Pin 3 open or greater than or equal to 2.4V. In shutdown, the reference draws a maximum supply current of 35 µA. Figure 3 shows the transient response of shutdown while the part is delivering 25mA. After shutdown, the reference powers up in about 200 µs. 5V 1461 F03 Figure 3. Shutdown While Delivering 25mA, RL = 100Ω 0V PIN 3 0V VOUT PC Board Layout In 13- to 16-bit systems where initial accuracy and tem- perature coefficient calibrations have been done, the me- chanical and thermal stress on a PC board (in a card cage for instance) can shift the output voltage and mask the true temperature coefficient of a reference. In addition, the mechanical stress of being soldered into a PC board can cause the output voltage to shift from its ideal value. Surface mount voltage references are the most suscep- tible to PC board stress because of the small amount of plastic used to hold the lead frame. A simple way to improve the stress-related shifts is to mount the reference near the short edge of the PC board, or in a corner. The board edge acts as a stress boundary, or a region where the flexure of the board is minimum. The package should always be mounted so that the leads absorb the stress and not the package. The package is generally aligned with the leads parallel to the long side of the PC board as shown in Figure 5a. A qualitative technique to evaluate the effect of stress on voltage references is to solder the part into a PC board and deform the board a fixed amount as shown in Figure 4. The flexure #1 represents no displacement, flexure #2 is concave movement, flexure #3 is relaxation to no dis- placement and finally, flexure #4 is a convex movement. This motion is repeated for a number of cycles and the APPLICATIO S I FOR ATIO 1 2 3 4 1461 F04 Figure 4. Flexure Numbers |
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Similar Description - LT1461ACS8-5 |
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