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HLMP-ED80-XX000 Datasheet(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-ED80-XX000 Datasheet(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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5 / 40 page  5 Figure 5. Exploded view drawing HDNS-2200 (CLIP) HLMP-ED80 (LED) ADNS-2051 (SENSOR) CUSTOMER SUPPLIED PCB HDNS-2100 (LENS) CUSTOMER SUPPLIED BASE PLATE WITH RECOMMENDED ALIGNMENT FEATURES PER IGES DRAWING ADNS-2051 fig 5 PCB Assembly Considerations 1. Insert the sensor and all other electrical components into PCB. 2. Bend the LED leads 90° and then insert the LED into the assembly clip until the snap feature locks the LED base. 3. Insert the LED/clip assembly into PCB. 4. Wave Solder the entire assembly in a no-wash solder process utilizing solder fixture. The solder fixture is needed to protect the sensor during the solder process. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. The solder fixture is also used to set the reference height of the sensor to the PCB top during wave soldering (Note: DO NOT remove the kapton tape during wave soldering). 5. Place the lens onto the base plate. 6. Remove the protective kapton tape from optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. It is recom- mended not to place the PCB facing up during the entire mouse assembly process. The PCB should be held vertically during the kapton removal process. 7. Insert PCB assembly over the lens onto the base plate aligning post to retain PCB assembly. The sensor aperture ring should self-align to the lens. 8. The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment. 9. Install mouse top case. There MUST be a feature in the top case to press down onto the clip to ensure all com- ponents are interlocked to the correct vertical height. |
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Similar Description - HLMP-ED80-XX000 |
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