HEDS-9741 datasheet(5/6 Pages) AVAGO

Part #	HEDS-9741

Description	For 180, 300, 360 LPI Small Optical Encoder Modules

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Manufacturer	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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5 / 6 page

5

Flux – RMA Water Soluble (per

MIL-F-14256D)

Process Parameters

1. Flux

2. Pre-heat 60 seconds total

Nominal preheat temp: 90

°C

Min: 85

°C

Max: 110

°C

3. Solder Pot Zone

Nominal dip in time:

2.5 - 4.5 seconds

Min: 2.5 seconds

Max: 5 seconds

PCB top side: 140 -160

°C

PCB bottom side: 240 - 260

°C

4. Wave Solder 255

°C,

1.2 meters/minute line speed

5. Hot Water Wash

1st: 30

°C 45 seconds

2nd: 70

°C 90 seconds

6. Rinse

1st: 23

°C 45 seconds

2nd: 23

°C 45 seconds

7. Dry

1st: 80

°C 105 seconds

2nd: 95

°C 105 seconds

Package Dimensions

Mounting Option #50

Note:

If not specified, tolerances are xx.

± 0.7, xx.x ± 0.3, xx.xx ± 0.07 mm.

AGILENT

8.7

6.40

0.14

(OPTICAL CENTER)

2x

∅ 2.00 ± 0.03

1.4

5.0

3.9

R 1.4

10.1

7.5

4.2

3.90 ± 0.15

0.8

1.70 ± 0.22

4.2

3.0

9.8

1.8

3.8

0.50

20.2 ± 0.7

15.0

8.4

PART #

C = COUNTRY

OF ORIGIN

DATE CODE

12.6 ± 0.7

7.0

OPTION CODE

PIN 1 ID

LEAD THICKNESS = 0.25 mm

LEAD PITCH = 2.54 mm

10.8 ± 0.7

5.5 ± 0.4

R 2.6

Ordering Information

HEDS-974

Option

Lead Bend

0 – Straight Leads

1 – Bend Leads

Resolution Options

Q – 180 LPI, linear

2 – 300 LPI, linear

1 – 360 LPI, linear

Mounting Options

50 – Standard

50

51

52

53

54

55

HEDS-9740

Q

*

2*

1*

HEDS-9741

Q

2*

1

Recommended Wave Solder

Conditions

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HEDS-9741 Datasheet(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED

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