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DICE SPECIFICATION

RH1086K/RH1086H

LT 0599 50 Rev A • PRINTED IN USA

© LINEAR TECHNOLOGY CORPORATION 1998

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on

dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

DICE ELECTRICAL TEST LI ITS

Note 1: See thermal regulation specifications for changes in output

voltage due to heating effects. Load and line regulation are measured

at a constant junction temperature by low duty cycle pulse testing.

Load regulation is measured at the output lead

≈ 1/8" from the

package.

Note 2: Line and load regulation are guaranteed up to the maximum

power dissipation of 15W for the RH1086K, 3W for the RH1086H.

Power dissipation is determined by the input/output differential and the

output current. Guaranteed maximum power dissipation will not be

available over the full input/output voltage range. See Short Circuit

Current Curve in the LT1086 Series standard data sheet for available

output current.

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

Rad Hard die require special handling as compared to standard IC chips.

Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die

surface from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much “softer” than silicon

nitride.

LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the

die around from the chip tray, use a Teflon-tipped vacuum wand. This wand can be made by pushing a small diameter Teflon tubing onto the tip of

a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square

and flat to ensure good vacuum to die surface. Ensure the Teflon tip remains clean from debris by inspecting under stereoscope.

During die attach, care must be exercised to ensure no tweezers touch the top of the die.

Note 3: Dropout voltage is specified over the full output current range

of the device. Test points and limits are shown on the Dropout Voltage

Curve in the LT1086 Series standard data sheet.

Note 4: Minimum load current is defined as the minimum output

current required to maintain regulation. At 25V input/output differential

the device is guaranteed to regulate if the output current is greater than

10mA.

Note 5: Guaranteed by design but not tested at wafer sort.

Note 6: For compliance with 883 revision C current density spec.

RH1086K is derated to 1.0A max load operation.

I.D. No. 66-11-1086