YZT PACKAGE

(TOP VIEW)

D

C

B

A

3 2 1

TXB0104

TERMINAL ASSIGNMENTS

(YZT Package)

3

2

1

D

A4

GND

B4

C

A3

OE

B3

B

A2

B2

A

A1

B1

DESCRIPTION/ORDERING INFORMATION

This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to

accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the

high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;

the minimum value of the resistor is determined by the current-sourcing capability of the driver.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ — WCSP (DSBGA)

0.23-mm Large Bump – YZT

Reel of 3000

TXB0104YZTR

2K7

(Pb-free) 0.625-mm max height

UFBGA – GXU

Reel of 2500

TXB0104GXUR

YE04

UFBGA – ZXU (Pb-Free)

Reel of 2500

TXB0104ZXUR

YE04

TXB0104RGYR

QFN – RGY

Reel of 1000

YE04

TXB0104RGYRG4

–40

°C to 85°C

TXB0104D

Tube of 50

TXB0104DG4

SOIC – D

TXB0104

TXB0104DR

Reel of 2500

TXB0104DRG4

TXB0104PWR

TSSOP – PW

Reel of 2000

YE04

TXB0104PWRG4

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

YZT: The actual top-side marking has three preceding characters to denote year, month, amd sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

2

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Product Folder Link(s): TXB0104