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SC801IMLTR Datasheet(PDF) 9 Page - Semtech Corporation |
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SC801IMLTR Datasheet(HTML) 9 Page - Semtech Corporation |
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9 / 17 page  9 2004 Semtech Corp. www.semtech.com SC801 POWER MANAGEMENT Applications Information (Cont.) Layout Guidelines Try to keep the traces from the adaptor input to the VCC pins as wide as possible, to eliminate any voltage drop across the device input traces. You want to make sure the input-to-output voltage differential of the device does not approach the dropout voltage. A curve of the drop- out voltage vs. output current is shown on page 15. Any voltage dropped over the input traces from the adaptor will reduce the dropout voltage margin. Make the high current output trace from the VOUT pins as wide as possible. The BSEN line should be used prop- erly to compensate for any voltage drops from the out- put trace to the battery. Make a Kelvin connection with the BSEN trace to where VOUT connects the battery ter- minals. This is done by taking the BSEN trace and tying it to the VOUT trace as close to the battery terminals as possible. This way, any voltage drop across the trace re- sistance to the battery will be compensated for because BSEN will regulate the device output voltage (VOUT) at the point it connects to the VOUT trace. If you tie the BSEN line to the VOUT pin at the device you will eliminate the benefit of its purpose and the trace resistance drop will not be compensated. Therefore, it is best to have the BSEN trace follow in parallel the VOUT trace and tie them together at the contact point of the battery termi- nal for the best result. The bottom of the SC801 package has a heat slug and this slug should be tied to a ground plane of the PCB through one large via or a series of smaller vias. If there is no ground plane, an area should be dedicated on the bottom of the PCB to act as a heat sink. The evaluation board has 1 square inch of copper and allows an output current of greater that 1A. The more copper tied to this slug the greater the output current available before ther- mal limitations dominate. The two pins that are labeled NC are not connected to the die. Therefore, tying these pins to the ground plane offers no aide in heat removal and has no electrical benefit. |
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Similar Description - SC801IMLTR |
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