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RCLAMP0544M.TBT Datasheet(PDF) 5 Page - Semtech Corporation |
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RCLAMP0544M.TBT Datasheet(HTML) 5 Page - Semtech Corporation |
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5 / 11 page  5 2006 Semtech Corp. www.semtech.com PRELIMINARY PROTECTION PRODUCTS RClamp0544M Device Connection Options for Protection of Four High-Speed Data Lines The RClamp0544M TVS is designed to protect four data lines from transient over-voltages by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage (plus diode V F) the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Flow Through Layout The RClamp0544M is designed for have ease of PCB layout by allowing the traces to run straight through the device. Figure 1 shows the proper way to design the PCB board trace in order to use the flow through layout for two line pairs. The solid line represents the PCB trace. Note that the PCB traces are used to connect the pin pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For example, line 1 enters at pin 1 and exits at Pin 10 and the PCB trace connects pin 1 and 10 together. This is true for lines 2, 3, and 4. Ground is connected at pin 3. This pin should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the device near the input terminals or connec- tors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Applications Information 1 Line 1 Gnd Line 2 Line 3 Line 4 Line 1 Line 2 Line 3 Line 4 NC Figure 1. Flow through Layout for two Line Pairs Figure 1. Flow through Layout for two Line Pairs Figure 1. Flow through Layout for two Line Pairs Figure 1. Flow through Layout for two Line Pairs Figure 1. Flow through Layout for two Line Pairs Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. |
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