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TDA8950 Datasheet(PDF) 23 Page - NXP Semiconductors |
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TDA8950 Datasheet(HTML) 23 Page - NXP Semiconductors |
23 / 39 page TDA8950_1 © NXP B.V. 2008. All rights reserved. Preliminary data sheet Rev. 01 — 9 September 2008 23 of 39 NXP Semiconductors TDA8950 2 × 150 W class-D power amplifier 13.10 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks. This will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power. Fig 11. Printed-circuit board layout (quasi-single-sided); components view R19 FBGND R20, R21 ground 001aai421 |
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