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PCA9702PW Datasheet(PDF) 5 Page - NXP Semiconductors |
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PCA9702PW Datasheet(HTML) 5 Page - NXP Semiconductors |
5 / 28 page PCA9701_PCA9702_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 3 December 2008 5 of 28 NXP Semiconductors PCA9701; PCA9702 18 V tolerant SPI 16-bit/8-bit GPI with INT 6.2 Pin description [1] HWQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. Table 2. Pin description Symbol Pin Type Description SO24, TSSOP24 HWQFN24 TSSOP16 SDOUT 1 22 1 output 3-state serial data output; normally high-impedance INT 2 23 2 output open-drain interrupt output (active LOW) INT_EN 3 24 3 input interrupt output enable 1 = interrupt is enabled 0 = interrupt is disabled and high-impedance IN0 4 1 4 input input port 0 IN1 5 2 5 input input port 1 IN2 6 3 6 input input port 2 IN3 7 4 7 input input port 3 IN4 8 5 9 input input port 4 IN5 9 6 10 input input port 5 IN6 10 7 11 input input port 6 IN7 11 8 12 input input port 7 VSS 12 9[1] 8 ground ground supply IN8 13 10 - input input port 8 IN9 14 11 - input input port 9 IN10 15 12 - input input port 10 IN11 16 13 - input input port 11 IN12 17 14 - input input port 12 IN13 18 15 - input input port 13 IN14 19 16 - input input port 14 IN15 20 17 - input input port 15 CS 21 18 13 input chip select (active LOW) SCLK 22 19 14 input serial input clock SDIN 23 20 15 input serial data input (20 µA pull-down) VDD 24 21 16 supply supply voltage |
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