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TPS78233DDCT Datasheet(PDF) 11 Page - Texas Instruments |
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TPS78233DDCT Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 20 page  THERMAL INFORMATION THERMAL PROTECTION POWER DISSIPATION P =(V V ) I - ´ D IN OUT OUT (2) PACKAGE MOUNTING TPS782xx www.ti.com ........................................................................................................................................... SBVS115A – AUGUST 2008 – REVISED SEPTEMBER 2008 Thermal protection disables the device output when The ability to remove heat from the die is different for the junction temperature rises to approximately each package type, presenting different +160°C, allowing the device to cool. Once the considerations in the PCB layout. The PCB area junction temperature cools to approximately +140°C, around the device that is free of other components the output circuitry is enabled. Depending on power moves the heat from the device to the ambient air. dissipation, thermal resistance, and ambient Performance data for JEDEC low- and high-K boards temperature, the thermal protection circuit may cycle are given in the Dissipation Ratings table. Using on and off again. This cycling limits the dissipation of heavier copper increases the effectiveness in the regulator, protecting it from damage as a result of removing heat from the device. The addition of plated overheating. through-holes to heat-dissipating layers also improves the heatsink effectiveness. Power Any tendency to activate the thermal protection circuit dissipation depends on input voltage and load indicates excessive power dissipation or an conditions. Power dissipation (PD) is equal to the inadequate heatsink. For reliable operation, junction product of the output current times the voltage drop temperature should be limited to +125°C maximum. across the output pass element (VIN to VOUT), as To estimate the margin of safety in a complete design shown in Equation 2: (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least +35°C above the maximum expected ambient Solder pad footprint recommendations for the condition of your particular application. This TPS782 series are available from the Texas configuration produces a worst-case junction Instruments web site at www.ti.com through the temperature of +125°C at the highest expected TPS782 series product folders. ambient temperature and worst-case load. The internal protection circuitry of the TPS782 series has been designed to protect against overload conditions. However, it is not intended to replace proper heatsinking. Continuously running the TPS782 series into thermal shutdown degrades device reliability. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 11 |
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