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ADV3002BSTZ-RL Datasheet(PDF) 5 Page - Analog Devices |
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ADV3002BSTZ-RL Datasheet(HTML) 5 Page - Analog Devices |
5 / 28 page ADV3002 Rev. 0 | Page 5 of 28 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating AVCC to AVEE 3.7 V P5V_x 5.8 V AMUXVCC AVCC − 0.3 V < AMUXVCC < 5.8 V Internal Power Dissipation 1.2 W TMDS Single-Ended Input Voltage AVCC − 1.4 V < VIN < AVCC + 0.3 V TMDS Differential Input Voltage 2.0 V Voltage at TMDS Output VOUT < 3.7 V DDC Input Voltage AVEE − 0.3 V < VIN < AMUXVCC + 0.3 V CEC Input Voltage AVEE − 0.3 V < VIN < 4.0 V I2C Logic Input Voltage (EDID_SCL, EDID_SDA, I2C_SCL, I2C_SDA) AVEE − 0.3 V < VIN < 4.0 V Parallel Input Voltage (I2C_ADDR[1:0], RESETB) AVEE − 0.3 V < VIN < AMUXVCC + 0.3 V Parallel Input Voltage (SEL[1:0], TX_EN) AVEE − 0.3V < VIN < AVCC + 0.3 V Storage Temperature Range −65°C to +125°C Operating Temperature Range 0°C to +85°C Junction Temperature 150°C ESD Protection (HBM) on HDMI Input Pins ±8 kV ESD Protection (HBM) on All Other Pins ±2.5 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions: a device soldered in a 4-layer JEDEC circuit board for surface-mount packages. θJC is specified for the exposed pad soldered to the circuit board with no airflow. Table 5. Thermal Resistance Package Type θJA θJC Unit 80-Lead LQFP (ST-80-2) 51.3 15.3 °C/W ESD CAUTION |
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