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MFR2500001JA1 Datasheet(PDF) 8 Page - Vishay Siliconix |
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MFR2500001JA1 Datasheet(HTML) 8 Page - Vishay Siliconix |
8 / 9 page Document Number: 28737 For technical questions, contact: filmresistors.leaded@vishay.com www.vishay.com Revision: 21-Feb-08 133 NFR25/25H Fusible, Non-Flammable Resistors Vishay BCcomponents TEST PROCEDURES AND REQUIREMENTS IEC 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS NFR25 NFR25H TESTS IN ACCORDANCE WITH THE SCHEDULE OF IEC PUBLICATION 60115-8 4.4.1 visual examination no holes; clean surface; no damage 4.4.2 dimensions (outline) gauge (mm) see Dimensions Table 4.5 resistance (refer note on first page for measuring distance) applied voltage (+ 0/- 10 %): R - Rnom: max. ± 5 % R < 10 Ω: 0.1 V 10 Ω≤ R < 100 Ω:0.3 V 100 Ω≤ R <1kΩ:1 V 1k Ω≤ R <10kΩ:3V 10 k Ω≤ R ≤ 15 kΩ:10 V 4.18 20 (Tb) resistance to soldering heat thermal shock: 3 s; 350 °C; 3 mm from body ΔR max.: ± (0.25 % R + 0.05 Ω) 4.29 45 (Xa) component solvent resistance isopropyl alcohol or H2O followed by brushing in accordance with “MIL 202 F” no visual damage 4.17 20 (Ta) solderability 2 s; 235 °C good tinning; no damage 4.7 voltage proof on insulation URMS = 500 VRMS during 1 min; metal block method no breakdown or flashover 4.16 21 (U) robustness of terminations: 4.16.2 21 (Ua1) tensile all samples load 10 N; 10 s number of failures < 10 x 10−6 4.16.3 21 (Ub) bending half number of samples load 5 N; 4 x 90 ° number of failures < 10 x 10−6 4.16.4 21 (Uc) torsion other half of samples 3 x 360 ° in opposite directions no damage ΔR max.: ± (0.25 % R + 0.05 Ω) 4.20 29 (Eb) bump 3 x 1500 bumps in 3 directions; 40 g no damage ΔR max.: ± (0.25 % R + 0.05 Ω) 4.22 6 (Fc) vibration frequency 10 Hz to 500 Hz; displacement 1.5 mm or acceleration 10 g; 3 directions; total 6 h (3 x 2 h) no damage ΔR max.: ± (0.25 % R + 0.05 Ω) 4.19 14 (Na) rapid change of temperature 30 min at LCT and 30 min at UCT; 5 cycles no visual damage ΔR max.: ± (0.25 % + 0.05 Ω) 4.23 climatic sequence: 4.23.3 30 (Db) damp heat (accelerated) 1st cycle 4.23.6 30 (Db) damp heat (accelerated) remaining cycles 6 days; 55 °C; 95 % to 98 % RH Rins min.: 103 MW ΔR max.: ± (1 % R + 0.05 Ω) 4.24.2 3 (Ca) damp heat (steady state) (IEC) 56 days; 40 °C; 90 %to95 %RH; loaded with 0.01 Pn (IEC steps: 4 to 100 V) Rins max.: 1000 MΩ ΔR max.: ± (1 % R + 0.05 Ω) 4.25.1 endurance (at 70 °C) 1000 h; loaded with Pn or Vmax.; 1.5 h ON and 0.5 h OFF ΔR max.: ± (1 % R + 0.05 Ω) 4.25.3 endurance at upper category temperature 1000 h; no load ΔR max.: ± (1 % R + 0.05 Ω) 4.8.4.2 temperature coefficient at 20/LCT/20 °C and 20/UCT/20 °C (TCR x 10−6/K): 0.22 Ω≤ R ≤ 4.7 Ω≤ ± 200 x 10-6/K ≤ ± 200 x 10-6/K 4.7 Ω < R ≤ 15 Ω≤ ± 200 x 10-6/K ≤ ± 100 x 10-6/K 15 Ω < R ≤ 15 kΩ≤ ± 100 x 10-6/K ≤ ± 100 x 10-6/K 4.12 noise “IEC publication 60195” < 0.1 µV/V 4.26 accidental overload cheese-cloth nonflammable OTHER TESTS IN ACCORDANCE WITH IEC 60115 CLAUSES AND IEC 60068 TEST METHOD 4.17 20 (Ta) solderability (after ageing) 8 h steam or 16 h 155 °C; leads immersed 6 mm for 2± 0.5s in a solder bath at 235 ± 5 °C good tinning ( ≥ 95 % covered); no damage 4.6.1.1 insulation resistance maximum voltage Umax. DC = 500 V after 1 min; metal block method Rins min.: 104 MΩ see 2nd amendment to “IEC 60115-1”, Jan.’87 pulse load see the Pulse Loading Capabilities graphs |
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