Document Number: 28737

For technical questions, contact: filmresistors.leaded@vishay.com

www.vishay.com

Revision: 21-Feb-08

133

NFR25/25H

Fusible, Non-Flammable Resistors

Vishay BCcomponents

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

NFR25

NFR25H

TESTS IN ACCORDANCE WITH THE SCHEDULE OF IEC PUBLICATION 60115-8

4.4.1

visual examination

no holes; clean surface; no damage

4.4.2

dimensions (outline)

gauge (mm)

see Dimensions Table

4.5

resistance

(refer note on first page for

measuring distance)

applied voltage (+ 0/- 10 %):

R < 10

Ω: 0.1 V

10

Ω≤ R < 100 Ω:0.3 V

100

Ω≤ R <1kΩ:1 V

1k

Ω≤ R <10kΩ:3V

10 k

Ω≤ R ≤ 15 kΩ:10 V

4.18

20 (Tb)

resistance to soldering

heat

thermal shock: 3 s; 350

°C;

3 mm from body

ΔR max.: ± (0.25 % R + 0.05 Ω)

4.29

45 (Xa)

component solvent

resistance

brushing in accordance with

“MIL 202 F”

no visual damage

4.17

20 (Ta)

solderability

2 s; 235

°C

good tinning; no damage

4.7

voltage proof on insulation

1 min; metal block method

no breakdown or flashover

4.16

21 (U)

robustness of terminations:

4.16.2

21 (Ua1)

tensile all samples

load 10 N; 10 s

4.16.3

21 (Ub)

bending half number of

samples

load 5 N; 4 x 90

°

4.16.4

21 (Uc)

torsion other half of

samples

3 x 360

° in opposite directions

no damage

ΔR max.: ± (0.25 % R + 0.05 Ω)

4.20

29 (Eb)

bump

3 x 1500 bumps in 3 directions; 40 g

no damage

ΔR max.: ± (0.25 % R + 0.05 Ω)

4.22

6 (Fc)

vibration

frequency 10 Hz to 500 Hz;

displacement 1.5 mm or acceleration

10 g; 3 directions; total 6 h

(3 x 2 h)

no damage

ΔR max.: ± (0.25 % R + 0.05 Ω)

4.19

14 (Na)

rapid change of

temperature

30 min at LCT and

30 min at UCT; 5 cycles

no visual damage

ΔR max.: ± (0.25 % + 0.05 Ω)

4.23

climatic sequence:

4.23.3

30 (Db)

damp heat (accelerated)

4.23.6

30 (Db)

damp heat (accelerated)

remaining cycles

6 days; 55

°C; 95 % to 98 % RH

ΔR max.: ± (1 % R + 0.05 Ω)

4.24.2

3 (Ca)

damp heat

(steady state) (IEC)

56 days; 40

°C; 90 %to95 %RH;

loaded with 0.01 Pn

(IEC steps: 4 to 100 V)

ΔR max.: ± (1 % R + 0.05 Ω)

4.25.1

endurance (at 70

°C)

1000 h;

1.5 h ON and 0.5 h OFF

ΔR max.: ± (1 % R + 0.05 Ω)

4.25.3

endurance at upper

category temperature

1000 h;

no load

ΔR max.: ± (1 % R + 0.05 Ω)

4.8.4.2

temperature coefficient

at 20/LCT/20

°C and

20/UCT/20

0.22

4.7

15

4.12

noise

“IEC publication 60195”

< 0.1 µV/V

4.26

accidental overload

cheese-cloth

nonflammable

OTHER TESTS IN ACCORDANCE WITH IEC 60115 CLAUSES AND IEC 60068 TEST METHOD

4.17

20 (Ta)

solderability

(after ageing)

8 h steam or 16 h 155 °C;

leads immersed 6 mm

for 2± 0.5s

in a solder bath at 235 ± 5 °C

good tinning (

≥ 95 % covered);

no damage

4.6.1.1

insulation resistance

maximum voltage

after 1 min; metal block method

to “IEC 60115-1”, Jan.’87

pulse load

see the Pulse Loading Capabilities

graphs