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Y163110R0000T1W Datasheet(PDF) 2 Page - Vishay Siliconix |
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Y163110R0000T1W Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 5 page VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil) Vishay Foil Resistors Ultra High Precision Z-Foil Flip Chip Resistor with TCR of ± 0.05 ppm/°C, 35 % Space Saving versus Wraparound Design and PCR of 5 ppm at Rated Power www.vishay.com For any questions, contact: foil@vishay.com Document Number: 63106 2 Revision: 28-Jun-07 Note • For VFCP0805, VFCP1506, VFCP2010 and VFCP2512 DSCC Drawings, please contact foil@vishay.com Note 1. As shown + 0.01 W to allow for measurement errors at low values. TABLE 2 - DSCC SPECIFICATIONS (Vishay resistors are listed on the following DSCC specifications) MODEL DSCC MIL SPEC VFCP1206 2009 MIL-PRF-55342 FIGURE 2 -TRIMMING TO VALUES (Conceptual Illustration) Mutual Inductance Reduction due to Change in Current Direction Current Path Before Trimming Note: Foil shown in black, etched spaces in white Interloop Capacitance Reduction in Series Trimming Process Removes this Material from Shorting Strip Area Changing Current Path and Increasing Resistance Current Path After Trimming TABLE 3 - SPECIFICATIONS CHIP SIZE RATED POWER (mW) at + 70 °C MAXIMUM VOLTAGE RATING ( ≤ ) RESISTANCE RANGE ( Ω) MAXIMUM WEIGHT (mg) 0805 100 mW 34 V 10 to 12K 5.2 1206 250 mW 86 V 10 to 30K 10.3 1506 300 mW 109 V 10 to 40K 12 2010 400 mW 200 V 10 to 100K 25 2512 600 mW 220 V 10 to 150K 35 PR × TABLE 4 - LOAD LIFE STABILITY (+ 70 °C FOR 2000 HOURS) CHIP SIZE MAXIMUM ΔR LIMITS 0805 ± 0.005 % at 50 mW ± 0.01 % at 100 mW 1206 ± 0.005 % at 150 mW ± 0.01 % at 250 mW 1506 ± 0.005 % at 150 mW ± 0.01 % at 300 mW 2010 ± 0.005 % at 200mW ± 0.01 % at 400 mW 2512 ± 0.005 % at 500 mW ± 0.01 % at 600 mW TABLE 5 - PERFORMANCES TEST OR CONDITION MIL-PRF-55342 CHARACTERISTIC E ΔR LIMITS TYPICAL ΔR LIMITS MAXIMUM ΔR LIMITS1) Thermal Shock ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Low Temperature Operation ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Short Time Overload ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) High Temperature Exposure ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm) Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.015 % (150 ppm) Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm) Load Life Stability + 70 °C for 2000 hours at Rated Power ± 0.5 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) |
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