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TN1625-X00G Datasheet(PDF) 4 Page - STMicroelectronics |
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TN1625-X00G Datasheet(HTML) 4 Page - STMicroelectronics |
4 / 5 page 0 4 8 12 16 20 24 28 32 36 40 0 10 20 30 40 50 60 70 80 Rth(j-a) ( °C/W) S(Cu) (cm ) Fig. 9: Thermal resistance junction to ambient ver- sus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 µm). 12 5 10 100 200 500 1000 I (A),I t(A s) TSM Tj initial=25 °C ITSM I t tp(ms) Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and cor- responding value of I 2t. 01 23 45 1 10 100 200 I (A) TM Tj=25 °C Tj=Tj max. Tj max.: Vto=0.77V Rt=23m Ω V (V) TM Fig. 8: On-state characteristics (maximum values). 0 40 80 120 160 200 240 280 320 360 T( °C) 250 200 150 100 50 0 Epoxy FR4 board Metal-backed board 245 °C 215 °C t (s) Fig. 10: Typical reflow soldering heat profile, either for mounting on FR4 or metal-backed boards. ® TN1625-G 4/5 |
Similar Part No. - TN1625-X00G |
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Similar Description - TN1625-X00G |
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