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Document Number: 28747

10

Revision: 25-Jun-08

MFU Series - Thin Film Fuse

Vishay Beyschlag

Thin Film Flat Chip Fuses

TEST AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

IEC 60127-1, Miniature fuse - Part 1: Definitions for miniature

fuses and general requirements for miniature fuse-links

IEC 60127-4, Universal Modular Fuse Links (UMF)

UL 248-1, Low voltage fuses - Part 1: General Requirements

UL 248-14, Low voltage fuses - Part 14: Supplemental Fuses

For the full test schedule refer to the documents listed above.

The testing also covers most of the requirements specified

by METI and CCC.

The tests are carried out in accordance with IEC 60068 and

under standard atmospheric conditions in accordance with

IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated

temperature range: Lower Category Temperature, Upper

Category Temperature; damp heat, long term, 56 days) is

valid.

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

The components are mounted for testing on printed-circuit

boards in accordance with IEC 60127-4, unless otherwise

specified.

The requirements stated in the Test Procedures and

Requirements table are based on the required tests and

permitted

limits

of

IEC

60127-1

and

IEC

60127-4

respectively. However, some additional tests and a number

of improvements against those minimum requirements have

been included.

TEST PROCEDURES AND REQUIREMENTS

IEC

60127-4

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (

ΔR/R)

8.3.2

Substrate

bending

Depth 1 mm;

rate 1 mm/s

1 times

No visible damage

ΔR/R ≤ ± 10 %

8.6.2

58 (Td)

Solderability

Solder bath method; SnPb40;

non-activated flux;

(215 ± 3) °C;

(3 ± 0.3) s

Good tinning (

≥ 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Good tinning (

≥ 95 % covered);

no visible damage

8.7.2

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

No visible damage

ΔR/R ≤ ± 10 %

Reflow method 2

(IR/forced gas convection);

(260 ± 5) °C; (10 ± 1) s

No visible damage

ΔR/R ≤ ± 10 %

9.2.1

-

Time/current

characteristics

at nominal

temperature

Cold resistance at 0.1 x

destructive testing under

overcurrent conditions

(DC-Current)

MFU 0402

At 1.25 x

at 2.0 x

at 10 x

MFU 0402

0.8 A

≤ I

R

≤ 3.15 A

At 1.25 x

at 2.0 x

at 10 x

MFU 0603

MFU 0805

MFU 1206