Document Number 84789

Rev. 1.5, 16-May-08

www.vishay.com

11

Vishay Semiconductors

VLMG310./VLMH310./VLMO310./VLMP310./VLMY310.

For technical support, please contact: LED@vishay.com

REEL PACKAGE DIMENSION IN MM

FOR SMD LEDS, TAPE OPTION GS08

(= 1500 PCS.)

REEL PACKAGE DIMENSION IN MM

FOR SMD LEDS, TAPE OPTION GS18

(= 8000 PCS.) PREFERRED

SOLDERING PROFILE

Figure 30. Reel Dimensions - GS08

Figure 31. Reel Dimensions - GS18

180

178

Identification

4.5

3.5

2.5

1.5

13.00

12.75

63.5

60.5

14.4 max.

10.0

9.0

120°

94 8665

Label:

Vishay

Type

Group

Tape Code

Production

Code

Quantity

321

329

Identification

4.5

3.5

2.5

1.5

13.00

12.75

62.5

60.0

14.4 max.

10.4

8.4

120°

18857

Label:

Vishay

Type

Group

Tape Code

Production

Code

Quantity

Figure 32. Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020B)

Figure 33. Double Wave Soldering of Opto Devices (all Packages)

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s

max. ramp down 6 °C/s

19885

IR Reflow Soldering Profile for Lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 2a

max. 2 cycles allowed

255 °C

235 °C to 260 °C

2 K/s

ca. 200 K/s

ca. 2 K/s

second

wave

first wave

ca. 5 K/s

5 s

full line: typical

dotted line: process limits

Time (s)

lead temperature

300

250

200

150

100

50

0

0

100

150

200

250

948626-1

TTW Soldering

(acc. to CECC00802)

50

100 °C to 130 °C

forced cooling