Document Number: 81241

For technical questions, contact: emittertechsupport@vishay.com

www.vishay.com

Rev. 1.6, 31-Jul-08

295

VSMF3710

High Speed Infrared Emitting Diode, RoHS

Compliant, 890 nm, GaAlAs Double Hetero

Vishay Semiconductors

PACKAGE DIMENSIONS in millimeters

SOLDER PROFILE

Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 4 weeks

Moisture sensitivity level 2a, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

TAPE AND REEL

PLCC-2 components are packed in antistatic blister tape

(DIN IEC (CO) 564) for automatic component insertion.

Cavities of blister tape are covered with adhesive tape.

20541

Mounting Pad Layout

1.2

1.6 (1.9)

4

area covered with

solder resist

3.5 ± 0.2

3 + 0.15

CA

Pin identification

Ø 2.4

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

19841

255 °C