TYPICAL PERFORMANCES

Parameter

110

° TVC

5.9

Ω/10 mH

110

° TVC

9.6

Ω/27 mH

90

° TVC

15

Ω/30 mH

Unit

24

22.5

25

V

280

175

125

mA

0.6

1

0.7

ms

4.2

2.5

2.05

W

7

13

16

°C/W

60

60

60

°C

110

110

110

°C

20

20

20

ms

2.5

2.5

2.5

2.5

2.5

2.5

The power dissipated in the circuit must be re-

moved by adding an external heatsink.

Thanks to the HEPTAWATT

the heatsink is very simple, a screw a compression

spring (clip) being sufficient. Between the heatsink

and the packageit is better to insert a layerof silicon

grease, to optimize the thermal contact ; no electri-

cal isolation is needed between the two surfaces.

MOUNTING INSTRUCTIONS

Figure 4 : Mounting Examples

TDA8170

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