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ACAC061222K1F22K1P5 Datasheet(PDF) 5 Page - Vishay Siliconix |
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ACAC061222K1F22K1P5 Datasheet(HTML) 5 Page - Vishay Siliconix |
5 / 6 page www.vishay.com For technical questions, contact: filmresistors.thinfilmarray@vishay.com Document Number: 28751 280 Revision: 11-Sep-08 ACAC 0612, ACAS 0612 - Precision Vishay Beyschlag Precision Thin Film Chip Resistor Array TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with the following specifications: EN 60115-1, Generic specification (includes tests) EN 140400, Sectional specification (includes schedule for qualification approval) The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5202. The tests are carried out in accordance with IEC 60068* and under standard atmospheric conditions according to IEC 60068-1*, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified the following values apply: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) In the following table only the tests and requirements are listed with reference to the relevant clauses of EN 60115-1 and IEC 60068-2*; a short description of the test procedure is also given. Notes (1) Figures are given for equal values (2) For a single element • The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2* TEST METHOD TEST PROCEDURE REQUIREMENTS (1) PERMISSIBLE CHANGE ( ΔR) Stability for product types: ACAC 0612, ACAS 0612 47 Ω to 221 kΩ Climatic category (LCT/UCT/duration) - 55 °C/+ 125 °C/56 days 4.5 - Resistance - ± 0.5 %; ± 0.25 % 4.8.4.2 - Temperature coefficient At 20/LCT/ 20 °C and 20/UCT/20 °C ± 50 ppm/K; ± 25 ppm/K 4.25.1 - Endurance U = or U = Umax.; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (0.25 % R + 0.05 Ω) 4.25.3 - Endurance at upper category temperature 125 °C; 1000 h ± (0.25 % R + 0.05 Ω) 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± (0.25 % R + 0.05 Ω) 4.13 - Short time overload (2) U = 2.5 x or U = 2 x Umax.; 5 s ± (0.1 % R + 0.01 Ω) no visible damage 4.19 14 (Na) Rapid change of temperature 30 min at LCT and 30 min at UCT; 5 cycles ± (0.1 % R + 0.01 Ω) no visible damage 4.18.2 58 (Td) Resistance to soldering heat Reflow method 2 (IR/forced gas convention); (260 ± 5) °C; (10 ± 1) s ± (0.1 % R + 0.01 Ω) no visible damage 4.17.2 58 (Td) Solderability Solder bath method; SnPb; non-activated flux accelerated ageing 4 h/155 °C (215 ± 3) °C; (3 ± 0.3) s Good tinning ( ≥ 95 % covered); no visible damage Solder bath method; SnAgCu; non-activated flux accelerated ageing 4 h/155 °C (235 ± 3) °C; (2 ± 0.2) s 4.32 21 (Ue3) Shear (adhesion) 45 N No visible damage 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.1 % R + 0.01 Ω) no visible damage; no open circuit in bent position 4.7 - Voltage proof Urms = Uins 60 ± 5 s; against ambient, between adjacent resistors No flashover or breakdown P 70 x R P 70 x R |
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