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TSOP36136 Datasheet(PDF) 6 Page - Vishay Siliconix |
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TSOP36136 Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 13 page www.vishay.com Document Number: 82191 194 Rev. 1.6, 20-Aug-08 TSOP361.. Vishay Semiconductors IR Receiver Modules for Remote Control Systems PACKAGE DIMENSIONS in millimeters ASSEMBLY INSTRUCTIONS Reflow Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Excercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off Manual Soldering • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Finish soldering within 3 s • Handle products only after the temperature has cooled off 16629 |
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