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ACAC0612110R2220RPW Datasheet(PDF) 5 Page - Vishay Siliconix

Part # ACAC0612110R2220RPW
Description  Professional Thin Film Chip Resistor Array
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

ACAC0612110R2220RPW Datasheet(HTML) 5 Page - Vishay Siliconix

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Document Number: 28754
272
Revision: 11-Sep-08
ACAC 0612, ACAS 0612 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistor Array
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1, Generic specification (includes tests)
EN 140400, Sectional specification (includes schedule for
qualification approval)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068*
and under standard atmospheric conditions according to
IEC 60068-1*, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
In the following table only the tests and requirements are
listed with reference to the relevant clauses of EN 60115-1
and IEC 60068-2*; a short description of the test procedure
is also given.
Notes
(1) Figures are given for equal values
(2) For a single element
The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2*
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS (1)
PERMISSIBLE CHANGE (
ΔR)
Stability for product types:
ACAC 0612, ACAS 0612
47
Ω to 221 kΩ
Climatic category
(LCT/UCT/duration)
- 55 °C/+ 125 °C/56 days
4.5
-
Resistance
-
± 1 %; ± 0.5 %; ± 0.25 %
4.8.4.2
-
Temperature coefficient
At 20/LCT/ 20
°C and
20/UCT/20
°C
± 50 ppm/K; ± 25 ppm/K
4.25.1
-
Endurance
U =
or U = Umax.;
1.5 h on; 0.5 h off;
70
°C; 1000 h
± (0.25 % R + 0.05
Ω)
4.25.3
-
Endurance at upper
category temperature
125
°C; 1000 h
± (0.25 % R + 0.05
Ω)
4.24
78 (Cab)
Damp heat,
steady state
(40 ± 2)
°C; 56 days;
(93 ± 3) % RH
± (0.5 % R + 0.05
Ω)
4.13
-
Short time overload (2)
U = 2.5 x
or
U = 2 x Umax.; 5 s
± (0.1 % R + 0.01
Ω)
no visible damage
4.19
14 (Na)
Rapid change of
temperature
30 min at LCT and
30 min at UCT;
5 cycles
± (0.1 % R + 0.01
Ω)
no visible damage
4.18.2
58 (Td)
Resistance to soldering
heat
Reflow method 2
(IR/forced gas convention);
(260 ± 5)
°C;
(10 ± 1) s
± (0.25 % R + 0.01
Ω)
no visible damage
4.17.2
58 (Td)
Solderability
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3)
°C; (3 ± 0.3) s
Good tinning (
≥ 95 % covered);
no visible damage
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3)
°C; (2 ± 0.2) s
4.32
21 (Ue3)
Shear (adhesion)
45 N
No visible damage
4.33
21 (Ue1)
Substrate bending
Depth 2 mm, 3 times
± (0.1 % R + 0.01
Ω)
no visible damage;
no open circuit in bent position
4.7
-
Voltage proof
Urms = Uins
60 ± 5 s; against ambient,
between adjacent resistors
No flashover or breakdown
P
70 x R
P
70 x R


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