Document Number: 82176

www.vishay.com

Rev. 1.7, 10-Jun-08

183

TSOP61..

IR Receiver Modules for

Remote Control Systems

Vishay Semiconductors

PACKAGE DIMENSIONS

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 72 h while stored

under a max. temperature of 30 °C, 60 % RH after opening

the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as shown

in the diagram. Excercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled off

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