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VHP203JTP120K50XB Datasheet(PDF) 3 Page - Vishay Siliconix |
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VHP203JTP120K50XB Datasheet(HTML) 3 Page - Vishay Siliconix |
3 / 5 page Document Number: 63146 For any questions, contact: foil@vishay.com www.vishay.com Revision: 06-May-08 3 VHP203 (Z-Foil) Hermetically Sealed Miniature Ultra High Precision Z-Foil Technology Resistors with TCR of 0.05 ppm/°C, Tolerance of ± 0.001 % and Load Life Stability of ± 0.005 %, Unaffected by Humidity Vishay Foil Resistors Notes 1. Not to exceed power rating of resistor 2. 0.200" (5.08 mm) lead spacing available - specify VHP203J 3. Inductance (L) due mainly to the leads 4. The resolution limit of existing test equipment (within measurement capability of the equipment, or “essentially zero”) 5. µV/°C relates to EMF due to lead temperature difference and µV/W due to power applied to the resistor 6. Load life ΔR max. can be reduced through in-house oriented processes TABLE 3 - “H” SERIES SPECIFICATIONS Stability6) Load life at 2000 h ± 0.002 % maximum ΔR at 0.1 W per chip and at + 60 °C Shelf life ± 2 ppm (0.0002 %) after at least 10 years Current Noise < 0.010 µV (RMS)/V of applied voltage (- 40 dB) High Frequency Operation Rise time 1.0 ns without ringing Inductance (L)3) 0.1 µH maximum; 0.08 µH typical Capacitance (C) 1.0 pF maximum; 0.5 pF typical Voltage Coefficient < 0.1 ppm/V4) Thermal EMF5) 0.1 µV/°C maximum; 0.05 µV/°C typical; 1 µV/W maximum Hermeticity 10-7 atmospheric cc/s maximum TABLE 4 - ENVIRONMENTAL PERFORMANCE COMPARISON MIL-PRF-55182 CHAR J VHP203 MAXIMUM ΔR VHP203 TYPICAL ΔR Test Group I Thermal shock, 5 x (- 55 °C to + 125 °C) ± 0.2 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Short time overload, 6.25 x rated power, 5 s ± 0.2 % ± 0.01 % (100 ppm) ± 0.003 % (30 ppm) Test Group II Resistance temperature characteristics ± 25 ppm/°C table 1 ± 0.05 ppm/°C Characteristic Low temperature storage (24 h at - 65 °C) ± 0.15 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Low temperature operation (45 min, rated power at - 65 °C) ± 0.15 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Terminal strength ± 0.2 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Test Group III DWV ± 0.15 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Resistance to solder heat, 20 s at + 260 °C ± 0.1 % ± 0.01 % (100 ppm) ± 0.005 % (50 ppm) Moisture resistance ± 0.4 % ± 0.005 % (50 ppm) ± 0.001 % (10 ppm) Test Group IV Shock ± 0.2 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Vibration ± 0.2 % ± 0.01 % (100 ppm) ± 0.002 % (20 ppm) Test Group V Life test at 0.3 W at + 25 °C 2000 h ± 0.5 % ± 0.008 % (80 ppm) ± 0.002 % (20 ppm) Test Group Va Life test at 0.1 W at + 60 °C ± 0.5 % ± 0.008 % (80 ppm) ± 0.002 % (20 ppm) Test Group VI High temperature exposure (2000 h at + 125 °C) ± 2.0 % ± 0.02 % (200 ppm) ± 0.005 % (50 ppm) Test Group VII Voltage coefficient 5 ppm/V < 0.1 ppm/V < 0.1 ppm/V |
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