140 CRH

Vishay BCcomponents

Aluminum Capacitors

SMD (Chip), High Temperature

www.vishay.com

For technical questions, contact: aluminumcaps1@vishay.com

Document Number: 28396

68

Revision: 24-Oct-08

Fig.3 Recommended soldering pad dimensions

Table 3

Fig.4 Maximum temperature load during reflow soldering

Table 4

Note

Temperature measuring point on top of the case and terminals max. 2 runs with pause of min. 30 min in between

aa

c

b

aa

c

b

e

d

f

d

Case size Ø D

≥ 12.5 mm

Case size Ø D

≤ 10 mm

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

d

e

f

0810

3.5

2.5

3.0

-

-

-

1010

4.3

2.5

4.0

-

-

-

1014

4.3

2.5

4.0

-

-

-

1213

5.5

2.5

4.0

4.2

5.0

5.6

1216

5.5

2.5

4.0

4.2

5.0

5.6

t

1

200

150

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4

REFLOW SOLDERING CONDITIONS

PROFILE FEATURES

CASE CODE

0810 to 1014

CASE CODE

1213 to 1216

Max. time from 25

°C to T

Peak

240 s

200 s

Max. ramp-up rate to 150

°C

3 K/s

3 K/s

Max. time from 150

°C to 200 °C, (t

150 s

120 s

Ramp up rate from 200

°C to T

Peak

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

Max. time from 200

°C to 217 °C, (t

60 s

60 s

90 s

60 s

Max. time above 230

°C (t

40 s

30 s

250

°C

240

°C

5 s

10 s

6 K/s

6 K/s