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HFB16PA60C Datasheet(PDF) 2 Page - Vishay Siliconix |
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HFB16PA60C Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 7 page www.vishay.com For technical questions, contact: diodes-tech@vishay.com Document Number: 94056 2 Revision: 25-Jul-08 HFA16PA60CPbF Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 2 x 8 A ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Cathode to anode breakdown voltage VBR IR = 100 µA 600 - - V Maximum forward voltage VFM IF = 8.0 A See fig. 1 -1.4 1.7 IF = 16 A - 1.7 2.1 IF = 8.0 A, TJ = 125 °C - 1.4 1.7 Maximum reverse leakage current IRM VR = VR rated See fig. 2 -0.3 5.0 µA TJ = 125 °C, VR = 0.8 x VR rated - 100 500 Junction capacitance CT VR = 200 V See fig. 3 - 10 25 pF Series inductance LS Measured lead to lead 5 mm from package body - 8.0 - nH DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Reverse recovery time See fig. 5, 6 and 16 trr IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 18 - ns trr1 TJ = 25 °C IF = 8.0 A dIF/dt = 200 A/µs VR = 200 V -37 55 trr2 TJ = 125 °C - 55 90 Peak recovery current See fig. 7 and 8 IRRM1 TJ = 25 °C - 3.5 5.0 A IRRM2 TJ = 125 °C - 4.5 8.0 Reverse recovery charge See fig. 9 and 10 Qrr1 TJ = 25 °C - 65 138 nC Qrr2 TJ = 125 °C - 124 360 Peak rate of fall recovery current during tb See fig. 11 and 12 dI(rec)M/dt1 TJ = 25 °C - 240 - A/µs dI(rec)M/dt2 TJ = 125 °C - 210 - THERMAL - MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Lead temperature Tlead 0.063" from case (1.6 mm) for 10 s - - 300 °C Junction to case, single leg conducting RthJC -- 3.5 K/W Junction to case, both leg conducting - - 1.75 Thermal resistance, junction to ambient RthJA Typical socket mount - - 40 Thermal resistance, case to heatsink RthCS Mounting surface, flat, smooth and greased - 0.25 - Weight -6.0 - g -0.21- oz. Mounting torque 6.0 (5.0) - 12 (10) kgf · cm (lbf · in) Marking device Case style TO-247AC (JEDEC) HFA16PA60C |
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