Document Number: 30132

For technical questions, contact: ww2bresistors@vishay.com

www.vishay.com

Revision: 31-Jul-08

27

WSL4026

High Power, Surface Mount

Vishay Dale

DIMENSIONS

Note

• Embossed Carrier Tape per EIA-481-2

MODEL

DIMENSIONS in inches [millimeters]

LW

H

R

S

T

U

WSL4026

0.400 ± 0.008

[10.1 ± 0.2]

0.260 + 0.012/- 0.008

[6.6 + 0.3/- 0.2]

0.117 ± 0.008

[3.0 ± 0.2]

0.039 ± 0.004

[1.0 ± 0.1]

0.028 ± 0.004

[0.7 ± 0.1]

0.016 ± 0.002

[0.4 ± 0.05]

0.078 ± 0.004

[2.0 ± 0.1]

MODEL

SOLDER PAD DIMENSIONS

in inches [millimeters]

ab

cd

w

WSL4026

0.220

[5.6]

0.096

[2.44]

0.035

[0.89]

0.035

[0.89]

0.420

[10.6]

W

L

S

R

d

a

b

b

w

T

U

c

H

70

Derating

120

100

80

60

40

20

0

- 65 - 50

- 25

0

25

50

75

100

125

150

170

Ambient Temperature in °C

PERFORMANCE

TEST

CONDITIONS OF TEST

TEST LIMITS

Thermal Shock

- 55 °C to + 150 °C, 1000 cycles, 15 min at each extreme

± (0.5 % + 0.0005

Ω) ΔR

Short Time Overload

0.5, 2 and 3 m

Ω - 5 x rated power for 5 s

5 m

Ω - 3 x rated power for 5 s

± (0.5 % + 0.0005

Ω) ΔR

Low Temperature Operation

- 65 °C for 45 min

± (0.5 % + 0.0005

Ω) ΔR

High Temperature Exposure

1000 h at + 170 °C

± (1.0 % + 0.0005

Ω) ΔR

Bias Humidity

+ 85 °C, 85 % RH, 10 % Bias, 1000 h

± (0.5 % + 0.0005

Ω) ΔR

Mechanical Shock

100 g’s for 6 ms, 5 pulses

± (0.5 % + 0.0005

Ω) ΔR

Vibration

Frequency varied 10 to 2000 Hz in 1 min, 3 directions, 12 h

± (0.5 % + 0.0005

Ω) ΔR

Load Life

1000 h at + 70 °C, 1.5 h “ON”, 0.5 h “OFF”

± (1.0 % + 0.0005

Ω) ΔR

Resistance to Solder Heat

+ 260 °C Solder, 10 - 12 s dwell, 25 mm/s emergence

± (0.5 % + 0.0005

Ω) ΔR

Moisture Resistance

MIL-STD-202, Method 106, 0 % power, 7b not required

± (0.5 % + 0.0005

Ω) ΔR

PACKAGING

MODEL

REEL

TAPE WIDTH

DIAMETER

PIECES/REEL

CODE

WSL4026

16 mm/Embossed Plastic

330 mm/13"

1500

EA