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STPS1H100A Datasheet(PDF) 4 Page - STMicroelectronics |
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STPS1H100A Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 6 page  0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1E-2 1E-1 1E+0 1E+1 2E+1 VFM(V) IFM(A) Tj=25°C Tj=125°C Fig. 11: Forward voltage drop versus forward current (maximum values). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 30 40 50 60 70 80 90 100 110 120 130 140 Rth(j-a) (°C/W) S(Cu) (cm²) Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMA). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 30 40 50 60 70 80 90 100 110 120 S(Cu) (cm²) Rth(j-a) (°C/W) Fig. 9: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB). STPS1H100A/U 4/6 |
Similar Part No. - STPS1H100A |
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Similar Description - STPS1H100A |
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