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FSA2567 Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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FSA2567 Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 2 page November 2007 © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2567 Rev. 1.0.1 Click to see this datasheet in Simplified Chinese! FSA2567 — Low-Power, Dual SIM Card Analog Switch Features Low On Capacitance for Data Path: 10pF Typical Low On Resistance for Data Path: 6Ω Typical Low On Resistance for Supply Path: 0.4Ω Typical Low Power Consumption: 1μA Maximum - 15μA Maximum ICCT Over Expanded Voltage Range (VIN=1.8V, VCC=4.3V) Wide -3db Bandwidth: > 160MHz Packaged in: - Pb-free 16-Lead MLP - Pb-free 16-Lead UMLP (1.8 x 2.6mm) 3kV ESD Rating, >12kV Power/GND ESD Rating Applications Cell phone, PDA, Digital Camera, and Notebook LCD Monitor, TV, and Set-Top Box IMPORTANT NOTE: For additional performance information, please contact analogswitch@fairchildsemi.com. Description The FSA2567 is a bi-directional, low-power, dual double-pole, double-throw (4PDT) analog switch targeted at dual SIM card multiplexing. It is optimized for switching the WLAN-SIM data and control signals and dedicates one channel as a supply-source switch. The FSA2567 is compatible with the requirements of SIM cards and features a low on capacitance (CON) of 10pF to ensure high-speed data transfer. The VSIM switch path has a low RON characteristic to ensure minimal voltage drop in the dual SIM card supply paths. The FSA2567 contains special circuitry that minimizes current consumption when the control voltage applied to the SEL pin is lower than the supply voltage (VCC). This feature is especially valuable in ultra-portable applications, such as cell phones; allowing direct interface with the general-purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers. Ordering Information Part Number Top Mark Operating Temperature Range Package FSA2567MPX FSA2567 -40 to +85°C 16-Lead, Molded Leadless Package (MLP) Quad, JEDEC MO-220, 3mm Square FSA2567UMX GX -40 to +85°C 16-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.8 x 2.6mm All packages are lead free per JEDEC: J-STD-020B standard. 1VSIM 2VSIM V SIM 1RST 2RST RST Sel 1CLK 2CLK CLK 2DAT DAT 1DAT Figure 1. Analog Symbol |
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