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FAN5182QSCX_NA3E229 Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FAN5182QSCX_NA3E229 Datasheet(HTML) 4 Page - Fairchild Semiconductor |
4 / 19 page © 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5182 • Rev. 1.1.3 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Unless otherwise noted, all voltages are referenced to GND. Symbol Parameter Min. Max. Unit VCC -0.3 +15 V FBRTN -0.3 +0.3 V EN, DELAY, ILIMIT, RT, PWM1-PWM3, COMP -0.3 5.5 V SW1-SW3 -5 +25 V VCC All Other Inputs and Outputs -0.3 VCC + 0.3 V TJ Operating Junction Temperature 0 +125 °C TSTG Storage Temperature -65 +150 °C TL Lead Soldering Temperature (10 Seconds) +300 °C TLI Lead Infrared Temperature (15 Seconds) +260 °C ΘJC Thermal Resistance Junction-to-Case 38 °C/W ΘJA Thermal Resistance Junction-to-Ambient (1) 90 °C/W Note: 1. Junction-to-ambient thermal resistance, ΘJA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. It is measured with the device mounted on a board of FR-4 material, 0.063inch thickness, no copper plane, and zero air flow. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Typ. Max. Unit VCC Supply Voltage Range 10.8 12.0 13.2 V TA Operating Ambient Temperature 0 +85 °C |
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