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FAN5361UC182X Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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FAN5361UC182X Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 17 page © 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5361 • Rev. 1.0.0 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VIN Input Voltage –0.3 7.0 V VSW Voltage on SW Pin –0.3 VIN + 0.3 (3) V VCTRL EN and MODE Pin Voltage –0.3 VIN + 0.3 (3) V Other Pins –0.3 VIN + 0.3 (3) V Human Body Model per JESD22-A114 4 kV ESD Electrostatic Discharge Protection Level Charged Device Model per JESD22-C101 1.5 kV TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 3. Lesser of 7V or VIN+0.3V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Typ. Max. Units VCC Supply Voltage Range 2.3 5.5 V IOUT Output Current 0 600 mA L Inductor 0.47 µH CIN Input Capacitor 2.2 µF COUT Output Capacitor 4.7 µF TA Operating Ambient Temperature –40 +85 °C TJ Operating Junction Temperature –40 +125 °C Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 1s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. Symbol Parameter Typical Units WLCSP 150 °C/W θJA Junction-to-Ambient Thermal Resistance MLP 49 °C/W |
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