5

Figure 2. Package and dimensions

Figure 3. Assembly diagram (single-supply, positive-bias configuration shown)

Symbol

Min.

Max.

A

1.35

1.75

A1

0.0

.25

B

0.33

0.51

C

0.19

.025

D

4.80

5.00

E

3.80

4.00

e

1.27 BSC

1.27 BSC

H

5.80

6.20

L

0.40

1.27

a

0°

0°

Notes

:

• All dimensions in millimeters.

• Refer to JEDEC Outline MS-012 for additional tolerances.

• Exposed heat slug area on package bottom = 2.67 x 1.65.

• Exposed heat sink on package bottom must be soldered to

PCB rf ground plane.