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HMMC-3102-BLK Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard) |
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HMMC-3102-BLK Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard) |
5 / 6 page 5 Figure 2. Package and dimensions Figure 3. Assembly diagram (single-supply, positive-bias configuration shown) Symbol Min. Max. A 1.35 1.75 A1 0.0 .25 B 0.33 0.51 C 0.19 .025 D 4.80 5.00 E 3.80 4.00 e 1.27 BSC 1.27 BSC H 5.80 6.20 L 0.40 1.27 a 0° 0° Notes : • All dimensions in millimeters. • Refer to JEDEC Outline MS-012 for additional tolerances. • Exposed heat slug area on package bottom = 2.67 x 1.65. • Exposed heat sink on package bottom must be soldered to PCB rf ground plane. |
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