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HMMC-3102 Datasheet(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HMMC-3102 Datasheet(HTML) 4 Page - Agilent(Hewlett-Packard) |
4 / 6 page 4 Input dc Offset If an RF signal with sufficient signal to noise ratio is present at the RF input lead, the prescaler will operate and provide a divided output equal the input frequency divided by the divide modulus. Under certain "ideal" condi- tions where the input is well matched at the right input frequency, the com- ponent may “self-oscillate”, especially under small signal input powers or with only noise present at the input This “self-oscillation” will produce a undesired output signal also known as a false trigger. To prevent false triggers or self-oscillation conditions, apply a 20 to 100 mV dc offset voltage between the RFin and RFin ports. This prevents noise or spurious low level signals from triggering the divider. Adding a 10 kΩ resistor between the unused RF input to a contact point at the VEE potential will result in an offset of ≈ 25 mV between the RF inputs. Note however, that the input sensitiv- ity will be reduced slightly due to the presence of this offset. Assembly Notes Independent of the bias applied to the package, the backside of the package should always be connected to both a good RF ground plane and a good thermal heat sinking region on the PC board to optimize performance. For single-ended output operation the unused RF output lead should be ter- minated into 50 Ω to a contact point at the VCC potential or to RF ground through a dc blocking capacitor. A minimum RF and thermal PC board contact area equal to or greater than 2.67 × 1.65 mm (0.105" × 0.065") with eight 0.020" diameter plated-wall thermal vias is recommended. MMIC ESD precautions, handling con- siderations, die attach and bonding methods are critical factors in successful GaAs MMIC performance and reliability. Agilent application note #54, "GaAs MMIC ESD, Die Attach and Bonding Guidelines" provides basic information on these subjects. Moisture Sensitivity Classification: Class 1, per JESD22-A112-A. Figure 1. Simplified Schematic |
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